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Employees demand to pay social security. Xia Yiping: The problems are all being solved. If you escape, you won't come. Some netizens posted a video showing that Xia Yiping, CEO of Ji Yue, was surrounded by employees in the company, and some employees shouted at Xia Yiping: "Take out your savings and pay social security to employees." Some employees at the scene said that if social security is broken, how many people will be affected, don't talk empty talk. Xia Yiping responded that knowing that everyone is very angry, everyone has followed us for so long, and I am very grateful. "These problems are being solved. Now I am communicating with you. If I escape, I will not come." Xia Yiping, CEO of Extreme Vietnam, issued an internal letter on the afternoon of the 11th, acknowledging that the company was encountering difficulties and needed immediate adjustment. (Sina Technology)Extremely Yue insiders: Xia Yiping still stays in the company's on-site office and is seeking financing. I learned from the inside of Extremely Yue Automobile that on the morning of December 12, Extreme Yue CEO Xia Yiping appeared in the company's headquarters office. Xia Yiping said that he appeared first to prove to employees that he had not run away, to tide over the difficulties with the company, and second to communicate with employees face to face. "His main task at present is financing, and he is also actively contacting investors for help." Insiders revealed to reporters. (The Paper)Xia Yiping's internal letter was alleged to have been copied from Weilai Li Bin. Xia Yiping, CEO of Jiyue, released an internal letter on the afternoon of 11th, acknowledging that the company was encountering difficulties and needed to adjust immediately. Some netizens pointed out that part of Xia Yiping's internal letter copied the internal letter of Weilai Li Bin in 2023. Xia Yiping's internal letter mentioned that the following four things must be done well in the new entrepreneurial period: 1. Adhere to the long-term investment in core technologies to maintain the leading edge; 2. Strengthen sales and service capacity building to cope with fierce market competition; 3. Merge departments and posts with duplicate functions and change inefficient internal workflow; 4. Reduce projects that cannot improve financial performance in the short term. In 2023, Li Bin's internal letter also mentioned: ensure long-term investment in core key technologies and maintain the leading edge of technology and products; Ensure that sales and service capabilities can cope with fierce market competition; Ensure that 9 core products of 3 brands are listed as scheduled; Organize efficiency improvement, merge redundant departments and posts, change inefficient internal workflow and division of labor, and cancel inefficient posts; Improve the efficiency of resources, postpone and reduce the project investment that can not improve the company's financial performance within 3 years. (Sina Technology)

Shanghai Headquarters of the Central Bank: The amount of cross-border RMB settlement in Shanghai in November was 2,491.8 billion yuan. According to the news of Shanghai Headquarters of the Central Bank, as of the end of November, there were 102 banks in Shanghai that submitted information on cross-border RMB settlement business, with a settlement amount of 2,491.8 billion yuan in November and a cumulative settlement amount of 27,151.9 billion yuan from January to November.India's NIFTY 50 index fell, with the latest drop of 0.1%.The daily limit of Sanyuan shares and Panda dairy products rose due to changes in the dairy sector, while Sanyuan shares and Panda dairy products rose due to changes in the dairy sector. The western animal husbandry industry rose by over 15%, followed by Ligao food, qiaqia food and Nanqiao food.

Nanchang land port "Changsha-Xiamen-Hong Kong Link" rail-sea intermodal train was opened. On the morning of December 12th, two trains loaded with "Made in Jiangxi" drove out of Nanchang land port in turn under the supervision of Ganjiang New District Customs, marking the official opening of the "Changsha-Xiamen-Hong Kong Link" rail-sea intermodal train from Nanchang land port to Xiamen Port, which greatly boosted the construction of modern logistics system in Jiangxi to a new level. Compared with the past, under the new mode of "Changsha-Xiamen-Hong Kong Link", the transportation efficiency of goods destined for Southeast Asia is shortened by 5-7 days, and the transportation cost is reduced by 20%. (CCTV News)Musk is going to melt the Statue of Liberty? Musk also responded to the rumors of foreign media. Recently, a screenshot appeared on the American network. The content was that CNN published a report saying that Musk, a well-known American entrepreneur, was going to melt the Statue of Liberty in the United States to make a limited edition electric pickup truck. However, Reuters later denied that the CNN report was forged. A spokesman for CNN also told Reuters that the CNN report in the screenshot was forged, and CNN had never published such a report. At present, Musk himself has responded to this matter in a teasing tone on his social platform X. Musk wrote in three posts: "No, I will melt it 1000% (Statue of Liberty)"; "With a laser eye from space"; "and then cast it again before no one notices";Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)